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专利名称：Method for encapsulating an electrical
component, and surface acoustic wavedevice encapsulated using said method
发明人：Alois Stelzl,Hans Kruger,Gregor Feiertag申请号：US11485049申请日：20060712
公开号：US20060249802A1公开日：20061109
专利附图：
摘要：An arrangement having a component mounted on a carrier in a flip chip
construction which is encapsulated by a film, in particular a plastic film, laminated over theentire surface of the component. For additional sealing and mechanical stabilization, aplastic compound in liquid form is subsequently applied and hardened so as to surroundthe chip.
申请人：Alois Stelzl,Hans Kruger,Gregor Feiertag
地址：Munchen DE,Munchen DE,Munchen DE
国籍：DE,DE,DE
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