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专利名称：Method of manufacturing a substrate,
substrate, device provided with a substrate,and determining method
发明人：Chiho Ogihara申请号：US12461268申请日：20090805公开号：US08309859B2公开日：20121113
专利附图：
摘要：A substrate includes a base material, a first solder part disposed on a surface ofthe base material and used for connection to an electronic component, and a second
solder part disposed on the surface of the base material and made of the same solder asthat of the first solder part. The top surface of the first solder part is made to be a flatsurface, and the maximum height of the second solder part from the surface of the basematerial is lower than the height of the flat surface of the first solder part from thesurface of the base material. Thus, a substrate for which the kind of solder can bedetermined easily and with certainty, a device provided with this substrate, a method ofmanufacturing the substrate, and a determining method are provided.
申请人：Chiho Ogihara
地址：Kanagawa JP
国籍：JP
代理机构：McGinn IP Law Group, PLLC
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